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Testing of gold plate welded by laser solder ball
With the development of microelectronics industry to lightweight, thin, miniaturization, the increase of the number of I / O terminals and the diversification of functions, flip chip packaging technology came into being, and underfill is the core process.The underfill process of
chip is to fill the gap between the chip and the substrate with glue to protect and strengthen the solder ball or solder pin. It is commonly used in flipchip packaging.
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